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Bostik SL C955 ADVANCED is a high performance smoothing compound that doesn’t require intensive subfloor preparation – saving you both time and money!

With exceptional flow characteristics, it can be applied directly to most common substrates without priming, including old adhesive residues, ceramic tiles, Bostik damp proof membranes, flooring grade plywood, and resin flooring.

It’s unaffected by moisture, meaning it can be used over damp subfloors, and can be applied from 2mm to 30mm in a single application when bulked out with a suitable aggregate.

It is specially formulated to be used in conjunction with waterborne underfloor heating systems and can also be used to encapsulate electric cable type heating. Due to its high adhesion and low shrinkage properties, it can be used without a primer onto most substrates in both domestic and commercial locations. It is ideal for refurbishment projects and may be applied onto firmly bonded thermoplastic tiles which have been installed on bituminous adhesives. Tiles must be stable, clean and degreased.